标准摘要
[中文适用范围]： IEC 60068 的这一部分概述了适用于带引线的设备的测试 T。 IEC 60068-2-58 中描述了表面安装器件 (SMD) 的焊接测试。本标准提供了在使用焊料合金（共晶或接近共晶锡铅（Pb）或无铅合金）的应用中确定器件的可焊性和耐热性的程序。本标准中的程序包括焊锡浴法和烙铁法。该标准的目的是确保元件引线或端子的可焊性满足 IEC 61191-3 和 IEC 61191-4 的适用焊点要求。此外，还提供了测试方法，以确保元件主体能够抵抗焊接过程中所承受的热负荷。注：有关润湿时间和润湿力的信息可以通过使用润湿天平的测试方法获得。请参阅 IEC 60068-2-54（锡浴法）和 IEC 60068-2-69（SMD 的锡浴和焊球法）。 [外文原描述]： IEC 60068-2-20:2008 outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. The major technical changes with regard to the fourth edition are the following: - the solder globule test is deleted; - test conditions and requirements for lead-free solders are added.
英文名称Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads