标准摘要
[中文适用范围]： 本部分 IEC 60068 概述了适用于带有引线和引线本身的设备的测试 Ta 和 Tb。表面安装设备（SMD）的焊接测试在 IEC 60068-2-58 中描述。 本文件提供了使用共晶或近共晶锡铅（Pb）或无铅合金的焊料合金应用中，确定设备的可焊性和耐焊热性的程序。 本文件中的程序包括焊浴法和烙铁法。 本文件的目的是确保组件引线或端子的可焊性符合 IEC 61191-3 和 IEC 61191-4 的适用焊点要求。此外，还提供了测试方法以确保组件主体能够抵抗在焊接过程中所暴露的热负荷。 注意：关于润湿时间和润湿力的信息可以通过使用润湿平衡的测试方法获得，可以查阅 IEC 60068-2-69（焊浴和焊球方法）。 [外文原描述]： IEC 60068-2-20:2021 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 60068-2-20:2021 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068‑2‑58. This document provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this document include the solder bath method and soldering iron method. The objective of this document is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can be resistant to the heat load to which it is exposed during soldering. This edition includes the following significant technical changes with respect to the previous edition: - update of and clarification of pre-conditioning (former "aging") and its relation to natural aging.
英文名称Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads