标准摘要
[中文适用范围]： IEC 60068 的这一部分概述了 Test Ta，即适用于任何形状的元件端子的焊锡润湿平衡方法，以确定可焊性。特别适合参考测试和其他方法无法定量测试的成分。对于表面安装器件 (SMD)，如果合适，应采用 IEC 60068-2-69。本标准提供了含铅 (Pb) 焊料合金和无铅焊料合金的标准程序。 [外文原描述]： IEC 60068-2-54:2006 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This second edition cancels and replaces the first edition, published in 1985 and constitutes a technical revision. The major technical changes with regard to the previous edition concern: - the addition of lead free solder alloy (see Clause 7, Materials); - reversal of force-time curves to align with IEC 60068-2-69 (see Figure 2 and Figure B.1); - modification to the test requirement for progress of wetting (see Clause 9).
英文名称Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method