标准摘要
[中文适用范围]： 范围和目标 IEC 60068 的这一部分概述了适用于用于安装在基板上的表面安装器件 (SMD)@ 的测试 Td@。本标准提供了含铅 (Pb) 焊料合金和无铅焊料合金的标准程序。本标准提供了测定无铅焊料合金的可焊性和耐热性的标准程序。本标准提供了确定共晶或接近共晶锡铅焊料的可焊性@金属化溶解（见 B.3.3）和焊接耐热性的标准程序。本标准中的程序包括焊浴法和回流焊法。当锡浴（浸）法合适时，锡浴法适用于为波峰焊设计的SMD和为回流焊设计的SMD。回流焊方法适用于为回流焊设计的SMD@，以确定SMD是否适合回流焊以及焊锡浴（浸入）方法不合适时。该标准的目的是确保使用 IEC 61760-1 中规定的每种焊接方法，元件引线或端子的可焊性满足 IEC 61191-2 中适用的焊点要求。此外，还提供了测试方法，以确保元件主体能够抵抗焊接过程中所承受的热负荷。 [外文原描述]： This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This standard provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys. This standard provides standard procedures for determining the solderability, dissolution of metallization and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders.
英文名称Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)