标准摘要
[中文适用范围]： 本部分IEC 60068概述了适用于表面安装器件（SMD）的测试Td。 本标准文件提供了在使用共晶或近共晶锡铅（Pb）或无铅合金的焊料合金应用中，确定器件的可焊性、金属化层抗溶解性和耐焊接热性的程序。 这些程序使用焊料槽法或回流法，并且仅适用于设计为能够承受短期浸入熔融焊料或有限暴露于回流系统的样品或产品。 焊料槽法适用于设计用于流动焊接的SMD，以及当焊料槽（浸渍）法适用时设计用于回流焊接的SMD。 回流法适用于设计用于回流焊接的SMD，以确定SMD是否适用于回流焊接，以及当焊料槽（浸渍）法不适用时。 本标准的目标是确保元件引线或端子的可焊性。此外，还提供了测试方法，以确保元件本体能够抵抗其在焊接过程中所承受的热负荷。 本标准涵盖以下列出的测试Td1、Td2和Td3： Td1: 端子可焊性 - 方法1: 焊料槽法, 方法2: 回流法 Td2: 耐焊接热性 - 方法1: 焊料槽法, 方法2: 回流法 Td3: 反润湿和金属化层抗溶解性 - 方法1: 焊料槽法, 方法2: 回流法 注1：对于特定组件，可能存在其他测试方法。 注2：测试Td不适用于印刷线路板（PWB），参见IEC 61189-3。 注3：特定的通孔器件（器件供应商已特别记录支持回流焊接的）也包括在本标准中。 [外文原描述]： IEC 60068-2-58:2015+A1:2017 outlines test Td, applicable to surface mounting devices (SMD). This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow systems. The solder bath method is applicable to SMDs designed for flow soldering and SMDs designed for reflow soldering when the solder bath (dipping) method is appropriate. The reflow method is applicable to the SMD designed for reflow soldering, to determine the suitability of SMDs for reflow soldering and when the solder bath (dipping) method is not appropriate. This edition includes the following significant technical changes with respect to the previous edition: - the addition of Sn-Bi low temperature solder alloy; - the addition of several reflow test conditions in Table 7 - Resistance to soldering heat - Test conditions and severity, reflow method; - introduction of reflow test method for Test Td3: Dewetting and resistance to dissolution of metallization; - implementation of guidance for the choice of a test severity in Clause B.3. This consolidated version consists of the fourth edition (2015) and its amendment 1 (2017). Therefore, no need to order amendment in addition to this publication.
英文名称Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)