标准摘要
[中文适用范围]： IEC 60068 的这一部分概述了适用于表面安装器件 (SMD) 的测试 Td@。本标准提供了在使用共晶或近共晶锡铅 (Pb)@ 或无铅合金的焊料合金应用中确定器件的可焊性和耐热性的程序。当焊浴（浸入）方法合适时，焊浴方法适用于为波峰焊设计的 SMD 和为回流焊设计的 SMD。回流焊方法适用于为回流焊设计的SMD@，以确定SMD是否适合回流焊以及焊锡浴（浸入）方法不合适时。该标准的目的是确保元件引线或端子的可焊性。此外，还提供了测试方法，以确保元件主体能够抵抗焊接过程中所承受的热负荷。注 1：对于特定组件，可能存在其他测试方法。注 2：测试 Td 不适用于印刷线路板 (PWB)@参见 IEC 61189-3。注 3：特定的通孔器件（其中器件供应商有专门记录的回流焊接支持）也包含在本标准中。 [外文原描述]： IEC 60068-2-58:2015 outlines test Td, applicable to surface mounting devices (SMD). This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow systems. The solder bath method is applicable to SMDs designed for flow soldering and SMDs designed for reflow soldering when the solder bath (dipping) method is appropriate. The reflow method is applicable to the SMD designed for reflow soldering, to determine the suitability of SMDs for reflow soldering and when the solder bath (dipping) method is not appropriate. This edition includes the following significant technical changes with respect to the previous edition: - the addition of Sn-Bi low temperature solder alloy; - the addition of several reflow test conditions in Table 7 - Resistance to soldering heat - Test conditions and severity, reflow method; - introduction of reflow test method for Test Td3: Dewetting and resistance to dissolution of metallization; - implementation of guidance for the choice of a test severity in Clause B.3.
英文名称Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)