标准摘要
[中文适用范围]： 描述了表面贴装技术电子元件可焊性测试的两种润湿天平方法。这些方法定量地确定表面安装器件上端子的可焊性。 [外文原描述]： Describes two wetting balance methods. These methods determine quantitatively the solderability of terminations on surface mounted devices. The procedures describe the solder bath wetting balance method and the solder globuwetting balance method and are both applicable to components with metallic termination and metallized solder pads.
英文名称Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method