标准摘要
[中文适用范围]： IEC 60068的这一部分概述了适用于表面贴装器件的测试Te、焊池润湿平衡方法和焊球润湿平衡方法。这些方法定量地确定表面安装器件上端子的可焊性。 IEC 60068-2-54 也适用于表面安装设备，如果适用，应查阅。这些程序描述了焊浴润湿平衡方法和焊球润湿平衡方法，并且均适用于具有金属端子和金属化焊盘的元件。本标准提供了含铅 (Pb) 焊料合金和无铅焊料合金的标准程序。 [外文原描述]： IEC 60068-2-69:2007 outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively the solderability of terminations on surface mounting devices. IEC 60068-2-54 is also available for surface mounting devices and should be consulted if applicable. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are both applicable to components with metallic terminations and metallized solder pads. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This second edition cancels and replaces the first edition published in 1995 and constitutes a technical revision. The main changes from the previous edition are as follows: - Inclusion of lead-free alloy test conditions; - Inclusion of new fluxes for testing, reflecting development of fluxes that have happened in the industry in the past 20 years; - Inclusion of new component types, and updating test parameters for the whole component list.
英文名称Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method