标准摘要
[中文适用范围]： IEC 60068 的这一部分概述了 Te/Tc 测试、焊锡润湿平衡方法和焊球润湿平衡方法，以定量确定端子的可焊性。通过这些方法获得的数据并不打算用作通过/失败目的的绝对定量数据。该程序描述了焊锡浴润湿平衡方法和焊球润湿平衡方法。它们适用于具有金属端子和金属化焊盘的元件和印刷板。本文件提供了含铅和不含铅 (Pb) 焊料合金的测量程序。 [外文原描述]： IEC 60068-2-69:2017 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass–fail purposes. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads. This document provides the measurement procedures for solder alloys both with and without lead (Pb). This edition includes the following significant technical changes with respect to the previous edition: - integration of IEC 60068-2-54; - inclusion of tests of printed boards; - inclusion of new component types, and updating test parameters for the whole component list; - inclusion of a new gauge R & R test protocol to ensure that the respective wetting balance equipment is correctly calibrated. The contents of the corrigendum of January 2018 have been included in this copy.
英文名称Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method