标准摘要
[中文适用范围]： IEC 60068 的这一部分提供了对 SMD 的金属端子或金属化端子与焊膏的润湿性进行比较研究的方法。通过这些方法获得的数据并不打算用作通过或失败目的的绝对定量数据。注：IEC 60068-2-58 和 IEC 60068-2-69 中描述了 SMD 的不同可焊性测试方法。 IEC 60068-2-58 规定使用焊浴和回流焊方法进行目视评估。 IEC 60068-2-69 规定使用焊浴和焊球方法进行润湿平衡评估。 [外文原描述]： IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes. NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.
英文名称Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste