标准摘要
[中文适用范围]： IEC 60068-2-83:2025 RLV包含了官方的IEC国际标准及其修订版（Redline版本）。修订版仅提供英文版本，便于用户快速比较官方IEC标准与其前一版之间的所有变更。IEC 60068-2-83:2025提供了用于比较研究SMD（表面贴装器件）金属端子或金属化端子与焊膏润湿性能的方法。通过这些方法获得的数据不应用于作为判断合格与否的绝对定量依据。注：SMD的不同焊锡性测试方法在IEC 60068-2-58和IEC 60068-2-69中有描述。IEC 60068-2-58规定使用焊锡浴和回流方法进行视觉评估，IEC 60068-2-69规定使用焊锡浴和焊锡球方法进行润湿平衡评估。与前一版相比，本版的主要技术变更包括：a) 修改第5章，使其与IEC 60068-2-20:2021保持一致。 [外文原描述]： IEC 60068-2-83:2025 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 60068-2-83:2025 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder paste. Data obtained by these methods are not intended to be used as absolute quantitative data for pass/fail purposes. NOTE Different solderability test methods for SMD are described in IEC 60068‑2‑58 and IEC 60068‑2‑69. IEC 60068‑2‑58 specifies visual evaluation using solder bath and reflow method, IEC 60068‑2‑69 specifies wetting balance evaluation using solder bath and solder globule method. This edition includes the following significant technical change with respect to the previous edition: a) revise Clause 5 to align with that in IEC 60068‑2‑20:2021.
英文名称Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste