标准摘要
[中文适用范围]： 本部分IEC 60068提供了比较研究SMD金属端子或金属化端子与焊膏润湿性的方法。通过本方法获得的数据不适用于作为绝对定量数据用于通过/失败判定。 注：IEC 60068-2-58和IEC 60068-2-69描述了不同的SMD可焊性测试方法。IEC 60068-2-58规定了使用焊浴和回流法的视觉评估，IEC 60068-2-69规定了使用焊浴和焊球法的润湿平衡评估。 [外文原描述]： IEC 60068-2-83:2025 is available as IEC 60068-2-83:2025 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition. IEC 60068-2-83:2025 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder paste. Data obtained by these methods are not intended to be used as absolute quantitative data for pass/fail purposes. NOTE Different solderability test methods for SMD are described in IEC 60068‑2‑58 and IEC 60068‑2‑69. IEC 60068‑2‑58 specifies visual evaluation using solder bath and reflow method, IEC 60068‑2‑69 specifies wetting balance evaluation using solder bath and solder globule method. This edition includes the following significant technical change with respect to the previous edition: a) revise Clause 5 to align with that in IEC 60068‑2‑20:2021.
英文名称Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste