环境试验 第2-88部分:试验方法 XD试验：部件和组件对清洁剂的耐性 (IEC 60068-2-88:2025; EN IEC 60068-2-88:2025)

[中文适用范围]： IEC 60068‑2‑88:2025 规定了用于评估电子元器件、未装配电路板及组件对液态清洗剂及清洗工艺耐受性的测试方法，该等清洗工艺需由用户与供应商根据具体应用场景共同确定（清洗为必要工序时适用）。对于本意不需实施清洗工艺的电子元器件、未装配电路板及组件，不适用上述测试。 测试 XD1 与 XD2 主要用于对适用于清洗工艺的元器件及未装配电路板进行鉴定测试，亦可用于评估元器件及未装配电路板在制造过程中所用材料的兼容性及其特定清洗介质的适用性。测试 XD3 旨在评估适用于清洗工艺的电子元器件组装体在制造过程中（包括组装与焊接工序）所经受的多种清洗工艺时的耐受性及其影响。 [外文原描述]： IEC 60068‑2-88:2025 establishes test methods for the resistance of electronic and electromechanical components, unpopulated circuit boards and assemblies to liquid cleaning media and cleaning processes, which are agreed between user and supplier for applications, where cleaning is required. These tests are not applicable to components, unpopulated circuit boards and assemblies, which are not intended to be subjected to cleaning processes. Tests XD1 and XD2 primarily are intended for qualification testing of components and unpopulated circuit boards suitable for cleaning processes, but can be adopted as well to testing of material compatibility and specific cleaning media used in manufacturing processes of components and unpopulated circuit boards. Test XD3 is intended to determine the resistance of electronic assemblies suitable for cleaning processes to the various cleaning processes to which they are exposed during manufacturing, including the effects of assembly and soldering processes.