电子设备用固定电阻器.第2部分:分规范:电路板通孔组件用带引线的低功率薄膜电阻器（THT）

[中文适用范围]： 本部分 IEC 60115 适用于电子设备中使用的带有引线的固定低功率薄膜电阻器，通常通过通孔技术（THT）组装在电路板上。这些电阻器通常根据类型（不同几何形状）和样式（不同尺寸）以及产品技术进行描述。这些电阻器的电阻元件通常由一层保护性漆膜覆盖。这些电阻器具有导线端接，主要用于通过通孔技术安装在电路板上。本文件的目的是规定优选额定值和特性，并从 IEC 60115-1 中选择适当的质量评估程序、测试和测量方法，并为这种类型的电阻器提供一般性能要求。 [外文原描述]： IEC 60115-2:2023 is applicable to fixed low-power film resistors with termination leads for use in electronic equipment, which are typically assembled in through-hole technology (THT) on circuit boards. These resistors are typically described according to types (different geometric shapes) and styles (different dimensions) and product technology. The resistive element of these resistors is typically protected by a conformal lacquer coating. These resistors have wire terminations and are primarily intended to be mounted on a circuit board in through-hole technique. The object of this document is to state preferred ratings and characteristics and to select from IEC 60115-1 the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of resistor. This edition includes the following significant technical changes with respect to the previous edition: the definitions of product technologies and product classification levels of the generic specification, IEC 60115‑1:2020, have been adopted; the preferred dimensions given in Table 1 have been reviewed, and the legacy style RA_0922 has been removed; a basis for the optional specification of the lead eccentricity of axial leaded resistors has been amended in 4.2; the 'period-pulse high-voltage overload test' of IEC 60115‑1:2020, 8.3 has been adopted as default test method in 5.3.8, thereby replacing the legacy test 'periodic-pulse overload test' of IEC 60115‑1:2020, 8.4; the revised solderability test of IEC 60115‑1:2020, 11.1 has been adopted in 5.3.19 and 5.3.20; the combined solvent resistance test of IEC 60115‑1:2020, 11.3 has been adopted in 5.3.22; the 'endurance at room temperature test' of IEC 60115‑1:2020, 7.2 (prior IEC 60115 2:2014, Annex C) has been adopted as an optional test in 5.4.1; the 'single-pulse high-voltage overload test' of IEC 60115 1:2020, 8.2, applied with the pulse shape 10/700 in 5.3.7, is complemented with the optional alternative provided by the pulse shape 1,2/50 in 5.4.2; climatic tests for 'operation at low temperature' of IEC 60115‑1:2020, 10.2, and for 'damp heat, steady state, accelerated' of IEC 60115‑1:2020, 10.5, have been adopted as optional tests in 5.4.4 and 5.4.5, respectively; new guidance is provided in 6.2 on the presentation of stability requirements with their permissible absolute and relative deviations; acceptance criteria for the visual examination have been added in 6.5 and in Annex B; visual examination for the primary and proximity packaging has been added in 6.5.2 and in 7.2; the periodical evaluation of termination platings has been added as a new topic of quality assessment in 9.8; the revised test clause numbering of IEC 60115‑1:2020 has been applied; a new Annex C has been added to summarize workmanship requirements for the assembly of leaded film resistors, e.g. as given in the prior IEC 61192 series of standards; the informative Annex F (prior Annex B) on radial formed styles has been amended with details on a formed Z-bend style for surface-mount assembly.