标准摘要
[中文适用范围]： IEC 60191的这一部分给出了分立器件外形图的制作指南，包括引线数小于8的表面贴装半导体分立器件。对于引线数大于或等于8的表面贴装分立器件外形图的制作至 8，还应参考 IEC 60191-6。这些图纸的主要目的是指示设备中的装置所允许的空间，以及确保机械互换性所需的其他尺寸特征。完全互换性涉及其他考虑因素，例如相关半导体器件的电气和热特性。因此，这些图纸所代表的国际标准化鼓励设备制造商遵守图纸上显示的公差，以扩大其国际客户范围。它还为设备设计人员提供了从不同国家的供应商获得的设备之间的机械互换性的保证，前提是他们在图纸中留出设备中的空间，并注意有关底座、螺柱等的更精确信息。本文件中使用的参考字母符号的其他详细信息在附录 A 中给出。 [外文原描述]： IEC 60191-1:2018 gives guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8. This edition includes the following significant technical changes with respect to the previous edition: a) the Scope has been extended to include surface-mounted semiconductor devices with a lead count less than 8; b) a definition of the term "stand-off" has been added; c) the methods for locating the datum have been extended to be suitable for SMD-packages; d) the visual identification of terminal position one for automatic handling has been clarified; e) the rules for the drawing of terminals have been clarified; f) Table A.1 has been completed with symbols specifically for SMD-packages; g) Annex B "Standardization philosophy" has been deleted; h) a normative Annex with special rules for SMD-packages has been added; i) the examples of semiconductor device drawings have been aligned to state-of-the-art packages including SMD-packages.
英文名称Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices