标准摘要
[中文适用范围]： 涉及集成电路封装尺寸的设计程序以及将集成电路封装安装到载体中的规则。 [外文原描述]： Deals with design procedure for dimensions of integrated circuit packages, and rules for mounting integrated circuit packages into carriers.
英文名称Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - First supplement