标准摘要
Completes IEC 60191-3 by defining in a more satisfactory manner the mounted length and width of DIL and QUIL packages and giving recommendations for the bending of terminals of QUIL packages used for the mounting of integrated circuits. It also lists the dimensions permitting the definition of the families of packages of Form 3 and Form 4.
英文名称Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Second supplement