标准摘要
[中文适用范围]： 描述了半导体器件封装外形的命名和分类方法。提供一种为半导体封装生成通用描述性指示符的系统方法。该合并版本由第二版（1999 年）、修正案 1（2001 年）和修正案 2（2002 年）组成。因此，除了本出版物之外，无需订购修订。 [外文原描述]： Describes a method for the designation and the classification into forms of package outlines for semiconductor devices. Provides a systematic method for generating universal descriptive designators for semiconductor packages. This consolidated version consists of the second edition (1999), its amendment 1 (2001) and its amendment 2 (2002). Therefore, no need to order amendments in addition to this publication.
英文名称Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages