标准摘要
[中文适用范围]： 本部分 IEC 60191 规定了半导体器件封装轮廓的命名方法、封装轮廓形式的分类方法，以及生成半导体器件封装通用描述性标识符的系统方法。 描述性标识符提供了一种有效的沟通工具，但不包含保证封装互换性的隐含控制。 [外文原描述]： IEC 60191-4:2013+A1:2018 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition: a) Material code "S" is added to indicate a silicon based package. b) Description of "WL" is added to be used for general use. This consolidated version consists of the third edition (2013) and its amendment 1 (2018). Therefore, no need to order amendment in addition to this publication.
英文名称Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages