标准摘要
[中文适用范围]： 广泛，涉及半导体封装、测试及后续加工等多个环节，对于推动行业技术进步和规范化发展具有实际指导意义。该标准经过多轮技术论证，凝聚了国际专家的经验与共识，体现了当时领域内的先进水平。 ***此介绍可能不准确，请注意参考原文。 [外文原描述]： Gives recommendations applying to tape automated bonding (TAB) of integrated circuits. Dimension values or requirements given in this standard for tape width, perforations, test pattern, outer lead bonding (OLB), etc., correspond to the state of the market at the date of edition of this standard. More especially, tape width and perforation dimensions have been derived from motion picture film standards. Progress in integrated circuit (IC) technology resulting in a higher number of terminals and user requirements may lead in the future to additional or new dimensions.
英文名称Mechanical standardization of semiconductor devices. Part 5: Recommendations applying to tape automated bonding (TAB) of integrated circuits.