标准摘要
[中文适用范围]： IEC 60191 关于机械标准化的这一部分提出了适用于使用卷带自动键合 (TAB) 作为结构和互连功能主要组件的封装中提供的集成电路的建议。该标准适用于制造商向用户提供的成品组件，并且没有定义与 IC 到磁带接口（内引线键合或 ILB）相关的要求。 [外文原描述]： Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.
英文名称Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)