标准摘要
[中文适用范围]： 提供了端子间距小于或等于 0.80 mm、封装体轮廓为矩形的细间距焊盘网格阵列的所有类型结构和组成材料的通用外形图和尺寸。 [外文原描述]： Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.
英文名称Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type