标准摘要
[中文适用范围]： IEC 60191的这一部分给出了细间距球栅阵列（以下简称“FBGA”）和细间距焊盘栅阵列（以下简称“FLGA”）的开顶式半导体插座的设计指南。本标准旨在制定适用于 FBGA 和 FLGA 的测试和老化插座中的开顶式插座的外形图和尺寸。 [外文原描述]： IEC 60191-6-13:2007 gives a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array ("FBGA" hereafter) and Fine-pitch Land Grid Array ("FLGA" hereafter). This standard is intended to establish the outline drawings and dimensions of the open-top-type socket out of the test and burn-in sockets applied to FBGA and FLGA.
英文名称Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)