标准摘要
[中文适用范围]： IEC 60191 的这一部分规定了细间距球栅阵列 (FBGA) 和细间距焊盘栅格阵列 (FLGA) 的开顶式半导体插座的设计指南。特别是，IEC 60191的这一部分规定了应用于FBGA和FLGA的开顶式测试和老化插座的外形图和尺寸。 [外文原描述]： IEC 60191-6-13:2016 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA. This edition includes the following significant technical changes with respect to the previous edition: a) BGA package nominal length and width have been newly expanded to 43 mm and 43 mm, respectively. Accordingly, six socket sizes have been added to the socket group numbers 1, 2 and 3, and twenty-two socket sizes have been added to the socket group number 4.
英文名称Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)