标准摘要
[中文适用范围]： IEC 60191 的这一部分提供了 FBGA 或 FLGA 形式的堆叠封装和单独可堆叠封装的外形图和尺寸。 [外文原描述]： IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.
英文名称Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)