标准摘要
[中文适用范围]： IEC 60191 的这一部分提供了端子间距为 1 毫米或更大的所有方形球栅阵列封装 (BGA)@ 的标准外形图@尺寸@和推荐变化。 [外文原描述]： IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger. This standard cancels and replaces IEC/PAS 60191-6-18 published in 2008. This first edition constitutes a technical revision. The contents of the corrigenda of May 2010 and July 2010 have been included in this copy.
英文名称Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)