标准摘要
[中文适用范围]： 本部分 IEC 60191 规定了球栅阵列 (BGA)、细间距球栅阵列 (FBGA) 和细间距焊盘栅阵列 (FLGA) 封装在升高温度下的翘曲测量方法以及最大允许翘曲值。 [外文原描述]： IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.
英文名称Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage