标准摘要
[中文适用范围]： IEC 60191的这一部分涵盖了各种球端子封装的集成电路轮廓图的准备要求，例如陶瓷球栅阵列（C-BGA）、塑料球栅阵列（P-BGA）、带球栅阵列（ T-BGA）等以及柱端子封装，例如陶瓷柱栅阵列（C-CGA）。 [外文原描述]： IEC 60191-6-2:2001 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).
英文名称Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages