标准摘要
[中文适用范围]： IEC 60191 的这一部分规定了测量小外形 Jlead 封装 (SOJ) 封装尺寸的方法，封装外形形式 E 符合 IEC 60191-4。 [外文原描述]： IEC 60191-6-20:2010 specifies methods to measure package dimensions of small outline J-lead-packages (SOJ), package outline form E in accordance with IEC 60191-4.
英文名称Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)