标准摘要
[中文适用范围]： 给出了表面贴装半导体器件外形图绘制的一般规则。它补充了 IEC 60191-1 和 60191-3。它涵盖所有表面贴装分立半导体器件以及分类为形式的集成电路 [外文原描述]： Gives general rules for the preparation of outlines drawings of surface-mounted semiconductor devices. It supplements IEC 60191-1 and 60191-3. It covers all surface-mounted discrete semiconductors devices as well as integrated circuits classified as form E.
英文名称Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages