标准摘要
[中文适用范围]： IEC 60191 的这一部分规定了测量小外形封装 (SOP)、封装外形 E 型封装尺寸的方法，符合 IEC 60191-4。 [外文原描述]： IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.
英文名称Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)