标准摘要
[中文适用范围]： IEC 60191 的这一部分提供了球栅阵列封装 (BGA) 和焊盘栅格阵列封装 (LGA) 的硅基封装结构和材料通用的外形图和尺寸。 [外文原描述]： IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).
英文名称Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)