标准摘要
[中文适用范围]： 涵盖球栅阵列 (BGA) 尺寸测量方法的要求。 [外文原描述]： IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.
英文名称Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)