标准摘要
[中文适用范围]： IEC 60191的这一部分提供了细间距球栅阵列（以下简称FBGA）的所有类型结构和组成材料的通用外形图和尺寸，其端子间距小于或等于0.80毫米，其封装身体轮廓呈方形。随着电气设备的多功能化和高性能化，存在对面阵式封装的需求。本设计指南的目的是标准化 FBGA 封装的外形并确保其互换性。这些细间距阵列封装的端子间距和封装轮廓比 BGA 封装更小。 [外文原描述]： Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.
英文名称Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)