标准摘要
[中文适用范围]： IEC 60191的这一部分提供了端子间距小于或等于0.80mm且封装体的细间距焊盘网格阵列（以下简称FLGA）的所有类型结构和组成材料的通用外形图和尺寸。轮廓是正方形的。 [外文原描述]： IEC 60191-6-6:2001 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.
英文名称Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)