标准摘要
[中文适用范围]： 给出了两种类型的环氧树脂浸渍玻璃纤维布的性能要求，其中树脂固化至乙阶。它们用于将由金属包覆环氧玻璃层压板形成的印刷电路粘合在一起，以生产多层 [外文原描述]： Covers the bonding sheet material used in the fabrication of multilayer printed boards. The test methods for bonding sheet material are also dealt with.
英文名称Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards