标准摘要
[中文适用范围]： 规定了制造的阻焊材料以及包含材料、应用过程和印刷板的阻焊系统的测试方法、条件和要求。 [外文原描述]： Gives the test methods, conditions, and requirements for solder resist material as manufactured and for a solder resist system which comprises the material, the application process, and a printed board. Solder resist for the uses considered in this specification may be of two types, as specified by the purchaser. Provides three classes of requirements to reflect progressive increases in sophistication, functional performance requirements and testing severity.
英文名称Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards