标准摘要
[中文适用范围]： IEC 60286 的这一部分适用于用于连接到电子电路的无引线或带引线桩的电子元件的包装。它仅包括用于上述用途的元件编带所必需的尺寸。该标准还包括与单片芯片产品（包括裸芯片和凸块芯片（倒装芯片））的封装相关的要求。 [外文原描述]： IEC 60286-3:2007 is applicable to the tape packaging of electronic components without leads or with lead stumps which are intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This fourth edition cancels and replaces the third edition issued in 1997. It constitutes a technical revision. It contains the following significant technical changes with respect to the previous edition: a) implementation of Type IV (adhesive-backed punched plastic carrier tape for singulated bare die and other surface mount components); b) minor revisions related to tables, figures and references.
英文名称Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes