标准摘要
[中文适用范围]： IEC 60286的这一部分适用于用于连接到电子电路的无引线或有引线桩的电子元件的带式包装。它仅包括对用于上述目的的部件进行编带所必需的那些尺寸。该标准还包括与单片芯片产品的封装相关的要求，包括裸芯片和凸块芯片（倒装芯片）。 [外文原描述]： IEC 60286-3:2013 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This fifth edition cancels and replaces the fourth edition, published in 2007, as well as IEC 60286-3-1, published in 2009 and IEC 60286-3-2, published in 2009. It constitutes a full layout revision. In addition, this edition includes the following significant technical changes with respect to the previous edition: a) integration of IEC 60286-3-1:2009 as type 1b (Packaging of surface mount components on continuous pressed carrier tapes); b) integration of IEC 60286-3-2:2009 as type 2b (Packaging of surface mount components on blister carrier tapes 4 mm in width).
英文名称Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes