标准摘要
[中文适用范围]： IEC 60286 的这一部分适用于用于连接到电子电路的无引线或带引线桩@的电子元件的带式封装。它仅包括对用于上述目的的部件进行编带所必需的那些尺寸。该文件还包括与单片芯片产品的封装相关的要求，包括裸芯片和凸块芯片（倒装芯片）。 [外文原描述]： IEC 60286-3:2019 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This edition includes the following significant technical changes with respect to the previous edition: - addition of a table of the classification to symbols concerning tape, reel and common symbols; - additions of a figure of example of polarity and orientation and a figure of example of dot seal; - revision of requirements for camber; - addition of a definition of design value with regard to tilt.
英文名称Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes