标准摘要
[中文适用范围]： 本部分IEC 60286适用于无引线或有引线残端的电子元件的带式包装，这些元件旨在连接到电子电路。它仅包括对上述用途元件带式包装至关重要的尺寸。 本文件还包括与单颗芯片产品（包括裸芯片和凸点芯片（倒装芯片））包装相关的要求。 [外文原描述]： IEC 60286-3:2022 CMV contains both the official standard and its commented version. The commented version provides you with a quick and easy way to compare all the changes between IEC 60286-3:2022 edition 7.0 and the previous IEC 60286-3:2019 edition 6.0. Futhermore, comments from IEC TC 40 experts are provided to explain the reasons of the most relevant changes. IEC 60286-3:2022 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This edition includes the following significant technical changes with respect to the previous edition: addition terms and definitions. addition of a table of the classification to symbols concerning drive hole diameter and distance between the reel hole centre and the drive hole centre; addition of drive hole to the reel (optional); revision of reel hole diameter tolerances; revision of 72 mm tape size carrier tape width dimension tolerances; addition of Annex B (informative); addition of component size 0201M.
英文名称Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes