+AMD1:2019 CSV 特种绕组线规范第21部分:155级聚酰胺包覆的可焊聚氨酯漆包圆铜线

[中文适用范围]： 本部分IEC 60317规定了155级可焊双涂层漆包圆铜线的要求。底层涂层基于聚氨酯树脂，可以修改，只要它保留原始树脂的化学特性并满足所有规定的电线要求。叠加涂层基于聚酰胺树脂。 注：改性树脂是经过化学变化的树脂，或含有一个或多个添加剂以增强某些性能或应用特性。 本标准涵盖的标称导体直径范围为： 1级：0.050毫米至1.600毫米（包括1.600毫米）； 2级：0.050毫米至1.600毫米（包括1.600毫米）。 标称导体直径在IEC 60317-0-1:2013的第4条中规定。 [外文原描述]： IEC 60317-21:2013+A1:2019 specifies the requirements of solderable enamelled round copper winding wire of class 155 with a dual coating. The underlying coating is based on polyurethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is based on polyamide resin. NOTE - A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. The range of nominal conductor diameters covered by this standard is: - Grade 1: 0,050 mm up to and including 1,600 mm; - Grade 2: 0,050 mm up to and including 1,600 mm. The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013. This third edition cancels and replaces the second edition published in 1990, Amendment 1:1997 and Amendment 2:1999. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: - new 3.2.2 containing general notes on winding wire, formerly a part of the scope; - revision to references to IEC 60317-0-1:2013 to clarify that their application is normative; - consolidation of 17.1 and 17.2 of the solderability requirements; - modification to Clause 19, Dielectric dissipation factor; - new Clause 23, Pin hole test. This consolidated version consists of the third edition (2013) and its amendment 1 (2019). Therefore, no need to order amendment in addition to this publication. Keywords: requirements of solderable enamelled round copper winding wire, class 155, dual coating