特种绕组线规范. 第21部分: 155级涂覆聚酰胺的可焊接聚氨酯漆包圆铜线

[中文适用范围]： IEC 60317的本部分规定了155级双涂层可焊漆包圆铜绕组线的要求。底层涂层基于聚氨酯树脂@，可以对其进行修改，前提是保留原始树脂的化学特性并满足所有指定的电线要求。叠加涂层基于聚酰胺树脂。注：改性树脂是经过化学变化@或含有一种或多种添加剂以增强某些性能或应用特性的树脂。本标准涵盖的标称导体直径范围为： - 1 级：0@050 mm 至 1@600 mm（包括 1@600 mm）； - 2 级：0@050 mm 至 1@600 mm。 IEC 60317-0-1:2013 第 4 条规定了标称导体直径。 [外文原描述]： IEC 60317-21:2013 specifies the requirements of solderable enamelled round copper winding wire of class 155 with a dual coating. The underlying coating is based on polyurethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is based on polyamide resin. NOTE - A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. The range of nominal conductor diameters covered by this standard is: - Grade 1: 0,050 mm up to and including 1,600 mm; - Grade 2: 0,050 mm up to and including 1,600 mm. The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013. This third edition cancels and replaces the second edition published in 1990, Amendment 1:1997 and Amendment 2:1999. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: - new 3.2.2 containing general notes on winding wire, formerly a part of the scope; - revision to references to IEC 60317-0-1:2013 to clarify that their application is normative; - consolidation of 17.1 and 17.2 of the solderability requirements; - modification to Clause 19, Dielectric dissipation factor; - new Clause 23, Pin hole test. Keywords: requirements of solderable enamelled round copper winding wire, class 155, dual coating