标准摘要
[中文适用范围]： 本部分IEC 60317规定了155级可焊性双涂层漆包圆铜绕组线的要求。底层涂层基于聚氨酯树脂，可以改性，只要其保留原始树脂的化学特性并满足所有规定的线材要求。叠加的涂层是基于热塑性树脂的粘合层。 注：改性树脂是指经过化学变化或含有一种或多种添加剂以增强某些性能或应用特性的树脂。 本标准涵盖的标称导体直径范围为： - 1B级：0.020 mm至包括0.800 mm； - 2B级：0.020 mm至包括0.800 mm。 标称导体直径在IEC 60317-0-1:2013的第4条中规定。 [外文原描述]： IEC 60317-35:2013+AMD1:2019+AMD2:2024 CSV specifies the requirements of solderable enamelled round copper winding wire of class 155 with a dual coating. The underlying coating is based on poly-urethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin. NOTE - A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. The range of nominal conductor diameters covered by this standard is: - Grade 1B: 0,020 mm up to and including 0,800 mm; - Grade 2B: 0,020 mm up to and including 0,800 mm. The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013. This second edition cancels and replaces the first edition published in 1992, Amendment 1:1997 and Amendment 2:1999. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: - new 3.2.2 containing general notes on winding wire, formerly a part of the scope; - revision to references to IEC 60317-0-1:2013 to clarify that their application is normative; - modification to Clause 15 to remove specific wire specimen sizes; - consolidation of 17.1 and 17.2 of the solderability requirements; - new Clause 23, Pin hole test. Key words: requirements of solderable enamelled round copper winding wire, class 155, dual coating
英文名称Specifications for particular types of winding wires - Part 35: Solderable polyurethane enamelled round copper wire, class 155, with a bonding layer