特种绕组线规范. 第35部分: 155级有粘结层的可焊接聚氨酯漆包圆铜线

[中文适用范围]： IEC 60317的本部分规定了155级双涂层可焊漆包圆铜绕组线的要求。底层涂层基于聚氨酯树脂@，可以对其进行修改，前提是保留原始树脂的化学特性并满足所有指定的电线要求。叠加涂层是基于热塑性树脂的粘合层。注：改性树脂是经过化学变化@或含有一种或多种添加剂以增强某些性能或应用特性的树脂。本标准涵盖的导体标称直径范围为： ?C 1B 级：0@020 mm 至 0@800 mm； ?C 2B 级：0@020 mm 至 0@800 mm。 IEC 60317-0-1:2013 第 4 条规定了标称导体直径。 [外文原描述]： IEC 60317-35:2013 specifies the requirements of solderable enamelled round copper winding wire of class 155 with a dual coating. The underlying coating is based on poly-urethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin. NOTE - A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. The range of nominal conductor diameters covered by this standard is: - Grade 1B: 0,020 mm up to and including 0,800 mm; - Grade 2B: 0,020 mm up to and including 0,800 mm. The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013. This second edition cancels and replaces the first edition published in 1992, Amendment 1:1997 and Amendment 2:1999. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: - new 3.2.2 containing general notes on winding wire, formerly a part of the scope; - revision to references to IEC 60317-0-1:2013 to clarify that their application is normative; - modification to Clause 15 to remove specific wire specimen sizes; - consolidation of 17.1 and 17.2 of the solderability requirements; - new Clause 23, Pin hole test. Key words: requirements of solderable enamelled round copper winding wire, class 155, dual coating