电子设备用固定电容器.第19部分:分规范:金属化聚乙烯对苯二甲酸酯膜介质表面安装直流固定电容器

[中文适用范围]： 这些电容器具有金属化连接垫或焊带，旨在直接安装到混合电路基板或印刷板上。根据使用条件，它们可能具有“自我修复特性”，并且是原始的 [外文原描述]： IEC 60384-19:2006 is applicable to fixed surface mount capacitors for direct current, with metallized electrodes and polyethylene-terephthalate dielectric for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted direct onto substrates for hybrid circuits or onto printed boards. These capacitors may have "self-healing properties" depending on conditions of use. They are primarily intended for applications where the a.c. component is small with respect to the rated voltage. This second edition cancels and replaces the first edition published in 1993 and constitutes minor revisions related to tables, figures and references. This bilingual version (2012-03) corresponds to the monolingual English version, published in 2006-01.