电子设备中使用的固定电容器 第19部分：临时规范：采用金属化聚对苯二甲酸乙二醇酯薄膜电介质的固定表面贴装直流电容器（第 3.0 版）

[中文适用范围]： “IEC 60384 的这一部分适用于电子设备中使用的带有金属化电极和聚对苯二甲酸乙二醇酯电介质的直流固定表面贴装电容器。这些电容器具有金属化连接垫或焊条，旨在直接安装到基板上，以用于电子设备。混合电路或印制板上。根据使用条件，这些电容器可能具有“自愈特性”。它们主要用于交流分量相对于额定电压较小的应用。用于抑制电磁干扰的电容器是不包括@但包含在 IEC 60384-14 中。本标准的目的是规定首选额定值和特性，并从 IEC 60384-1:2008@适当的质量评估程序@测试和测量方法，并给出一般性能此类电容器的要求。参考本部分规范的详细规范中规定的测试严酷度和要求应具有相同或更高的性能水平@，因为不允许较低的性能水平。 [外文原描述]： IEC 60384-19:2015 is applicable to fixed surface mount capacitors for direct current, with metallized electrodes and polyethylene-terephthalate dielectric for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted directly onto substrates for hybrid circuits or onto printed boards. These capacitors may have "self-healing properties" depending on conditions of use. They are primarily intended for applications where the a.c. component is small with respect to the rated voltage. Capacitors for electromagnetic interference suppression are not included, but are covered by IEC 60384 14. This edition includes the following significant technical changes with respect to the previous edition: a) Revised all parts of the document based on the IEC Directives Part 2:2011 (sixth edition) to the extent practicable, and harmonization between other similar kind of documents. b) Revised tables and Clause 4 so as to prevent duplications and contradictions.