标准摘要
[中文适用范围]： IEC 60384的本部分适用于电子设备中使用的陶瓷电介质@1级@的固定非封装表面贴装多层电容器。这些电容器具有金属化连接垫或焊带，旨在安装在印刷板上或直接安装在混合电路的基板上。用于抑制电磁干扰的电容器不包括在内，但包含在 IEC 60384-14 中。 [外文原描述]： IEC 60384-21:2011 is applicable to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 1, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for hybrid circuits. Capacitors for electromagnetic interference suppression are not included, but are covered by IEC 60384-14. This second edition cancels and replaces the first edition published in 2004 and contains the following significant technical changes with respect to the previous edition: - The test voltage of 1,2 UR at UR greater or equal to 1 000 V has been added in 4.5.4 Voltage proof. - Detail test conditions have been added in 4.7 Shear test and 4.8 Substrate bending test. - Test conditions applying lead free solder alloy (Sn-Ag-Cu) have been included in 4.9 Resistance to soldering heat and 4.10 Solderability. - A selection of the test conditions according to marketing needs have been stated in 4.13 Damp heat, steady state. - The dimensions of 0402 M in Annex A have been added. - The code of the temperature coefficient and the tolerance of capacitance for the reference temperature of 25 °C have been added, see Annex B.
英文名称Fixed capacitors for use in electronic equipment - Part 21: Sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1