电子设备用固定电容器.第22部分:分规范:2级陶瓷介质的表面安装固定多层电容器

[中文适用范围]： IEC 60384的本部分适用于电子设备中使用的陶瓷电介质@2级@的固定非封装表面贴装多层电容器。这些电容器具有金属化连接垫或焊带，旨在安装在印刷板上或直接安装在混合电路的基板上。用于抑制电磁干扰的电容器不包括在内，但包含在 IEC 60384-14 中。 [外文原描述]： IEC 60384-22:2011 is applicable to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 2, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for hybrid circuits. Capacitors for electromagnetic interference suppression are not included, but are covered by IEC 60384-14. The object of this standard is to prescribe preferred ratings and characteristics and to select from IEC 60384-1 the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of capacitor. Test severities and requirements prescribed in detail specifications referring to this sectional specification should be of equal or higher performance level, lower performance levels are not permitted. This second edition cancels and replaces the first edition published in 2004 and contains the following significant technical changes with respect to the previous edition. - The measuring frequency of 1 MHz has been reduced to 1 kHz for 100 pF, see 4.5.1 Capacitance. - The test voltage of 1,2 UR at UR greater or equal to 1 000 V has been added in 4.5.4 Voltage proof. - Detail test conditions have been added in 4.7 Shear test and 4.8 Substrate bending test. - Test conditions applying lead free solder alloy (Sn-Ag-Cu) have been included in 4.9 Resistance to soldering heat and 4.10 Solderability. - A selection of the test conditions according to marketing needs has been stated in 4.13 Damp heat, steady state. - The dimensions of 0402 M in Annex A have been added. - The temperature characteristics code of capacitance for the reference temperature of 25 °C has been added, see Annex C.