IEC 60664-3:2003/AMD1:2010 现行

修改件1.低压系统内设备的绝缘配合.第3部分:防止污染的涂层、灌封或模制的使用

标准摘要

The contents of the corrigendum of November 2010 have been included in this copy.
英文名称Amendment 1 - Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution

替代关系

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